The service life of the connector is the
primary indicator of the reliability of the connector performance. As the
requirements for fault-free performance of electronic products continue to increase,
the service life of the china connector design becomes a design orientation.
Stress release data is an effective tool
for designers to predict the life of electronic connectors and make decisions
based on existing data on the choice of contact material. These data are now
widely used in the computer, communications and automotive electronics
industries. At present, the data on the life cycle of the product is very
scarce, especially in the computer field. Not only that, it also shortens the
product development cycle and the validity of a more useful data.
Most china connector designers use stress
release data primarily to reduce the range of contact material options based on
application requirements. However, many designers are also looking for
appropriate test methods to more accurately predict the characteristics of the
connector life. This can greatly reduce the number of samples required for
testing and the associated costs associated with testing a large number of
samples.
At present, most of the automotive chinaconnector in the harsh environment and in the hood are designed with 3 or 1
design requirements; and the operating temperature of the next generation of
automotive connectors is expected to increase. Except that most non-automotive
connectors do not seem to need to maintain their stability under the above
conditions. However, high-density connectors require a lower initial insertion
force, which in turn reduces stress release. This makes the stress release even
important at lower temperatures.
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